Part Number | BDL-108-G-F |
Main Category | Connectors, Interconnects |
Sub Category | Rectangular Connectors - Headers, Male Pins |
Brand | Samsung Semiconductor |
Description | CONN HEADER DUAL 16POS LOW PRO |
Series | BDL |
Packaging | Tube |
Connector Type | Header |
Contact Type | Male Pin |
Pitch - Mating | 0.100" (2.54mm) |
Style | Board to Board |
Shrouding | Unshrouded |
Number of Positions | 16 |
Number of Positions Loaded | All |
Number of Rows | 2 |
Row Spacing - Mating | 0.100" (2.54mm) |
Mounting Type | Through Hole |
Termination | Solder |
Fastening Type | - |
Contact Length - Mating | 0.122" (3.10mm) |
Contact Length - Post | 0.125" (3.18mm) |
Overall Contact Length | 0.332" (8.43mm) |
Insulation Height | 0.085" (2.15mm) |
Contact Shape | Circular |
Contact Finish - Mating | Gold |
Contact Finish Thickness - Mating | 20µin (0.51µm) |
Image |
BDL-108-G-F
SAMSUMG
1000
1.75
Lansheng Technology Co.,Ltd.
BDL-108-G-F
SANSUMG
100000
3.20333333333333
SUNGLOW (HONGKONG) TECHNOLOGY LIMITED
BDL-108-G-F
SAMSUN
20
4.65666666666667
United Sources Industrial Enterprises Limited
BDL-108-G-F
SANSUNG
20
6.11
United Sources Industrial Enterprises Limited