Samsung Semiconductor

Description

DATASHEET Less than 1.5W ( 388 PBGA). MCF547x ColdFire. . Figure 31.388-pin BGA Case Outline. . 388 pin TEPBGA Junction to ambient, natural convection. Cypress has changed the package type on the CYNSE70256 device from 388 BGA to 388 . Heat-Sink BGA for enhancements in the thermal characteristics of the BGA388 . SOT532-1. 1.27. 1.27. 0.75. 0.60. 35.50. 35.50. 0.10. BGA492. SOT514- The BGA family of packages are not suitable for wave soldering. LFBGA84. Jul 1, 2001 388 -ball Ball Grid Array ( BGA ) Package. MSL 3. ASE, Taiwan. CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell. TQFP, PQFP, and Fine Pitch BGA Package Options Family Member 100 TQFP 128 TQFP 208 PQFP 256 fpBGA* 272 BGA 388 fpBGA* 388 BGA 484 fpBGA*