Samsung Semiconductor

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We spark the imagination of device manufacturers with top-of-the-line building blocks of the digital area, powering billions of devices, and through them, touching the lives of people around the world every day. Samsung promises cutting-edge components services, TCO solutions and technical services with the widest product portfolio in the industry and adds value through our flexibility to collaborate with customers and partners, leveraging resources throughout the product development process.

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Description

Datasheet Jun 24, 2011 K4B1G1646G datasheet. DDR3 SDRAM. Rev. 1.11. Revision History. Revision No. History. Draft Date. Remark. Editor. 1.0. - First release. Nov. K4B1G1646G . BC(L)F8/H9/K0/MA/NB. 64M x 16. 96ball FBGA. 2Gb C-die. 8Banks. K4B2G1646C. HC(L)F8/H9/K0/MA/NB. 128M x 16. SSTL_15. 8K/64m. Alliance Memory, Inc. alliancememory.com 650.610.6800 Product Catalog 2014 14. DDR3 DRAM. DENSITY. ALLIANCE. MICRON. SAMSUNG. ISSI. HYNIX . K4B1G1646G -BCK. IS43TR16640A-xBL. H5TQ1G63EFR-x W631GG6KB-x M15F1G1664A-ADBG. EDJ1116DJBG NT5CB64M16FP-DH. EM6GC16EWXD- xxH. 1 -. Rev. 1.01, Aug. 2012. SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND. SPECIFICATIONS WITHOUT

Part Number K4B1G1646G
Brand Samsung Semiconductor
Image Electronic Components
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