Samsung Semiconductor

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We spark the imagination of device manufacturers with top-of-the-line building blocks of the digital area, powering billions of devices, and through them, touching the lives of people around the world every day. Samsung promises cutting-edge components services, TCO solutions and technical services with the widest product portfolio in the industry and adds value through our flexibility to collaborate with customers and partners, leveraging resources throughout the product development process.

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Description

K4B1G1646I datasheet. DDR3L SDRAM. Rev. 1.1. Revision History. Revision No . History. Draft Date. Remark. Editor. 1.0. - First Spec. Release. 16th Feb. 2016. Jun 24, 2011 Page 1. - 1 -. K4B1G1646G. Rev. 1.11, Jun. 2011. SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, Dec 19, 2016 (End of Life) with new K4B1G1646I -BCK0 (J37656-001). Intel reports validation completed with passing results. Current DDR3 (G38649-001). Mar 31, 2016 78 Ball -FBGA. Lead Free & Halogen Free, Flip Chip 1600/1866/2133. 7.5x11mm . Now. 128M x 16. K4B1G1646I -BCK0/MA/NB. 96 Ball -FBGA. K4B1G1646I . BYK0/MA. BMK0/MA. 64Mx16. 96 ball FBGA. 2Gb F-die. 8Banks. K4B2G0846F. BCK0/MA/NB. 256Mx8. 1.5V. 78 ball FBGA. MP. K4B2G1646F.

Part Number K4B1G1646I
Brand Samsung Semiconductor
Image Electronic Components
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