Samsung Semiconductor

Ref. [hkinsamsungsemiconductor20211220][hkinbrandcloudAMpd]

We spark the imagination of device manufacturers with top-of-the-line building blocks of the digital area, powering billions of devices, and through them, touching the lives of people around the world every day. Samsung promises cutting-edge components services, TCO solutions and technical services with the widest product portfolio in the industry and adds value through our flexibility to collaborate with customers and partners, leveraging resources throughout the product development process.

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Description

datasheet. DDR3L SDRAM. Rev. 1.0. K4B2G1646F . Revision History. Revision No. History. Draft Date. Remark. Editor. 1.0. - First SPEC release. 16th Feb. 2016. datasheet. DDR3 SDRAM. Rev. 1.0. K4B2G1646F . Revision History. Revision No . History. Draft Date. Remark. Editor. 1.0. - First SPEC release. 15th Jan. 2016. Oct 1, 2016 K4B2G1646F . BCK0/MA/NB. 128Mx16. 96 ball FBGA. K4B2G0846F. BYK0/MA. BMK0/MA. 256Mx8. 1.35V. 78 ball FBGA. MP. K4B2G1646F . Mar 31, 2016 78 Ball -FBGA. Lead Free & Halogen Free, Flip Chip 1600/1866/2133. 7.5x11mm . Now. 256M x 16. K4B2G1646F -BCK0/MA/NB. 96 Ball -FBGA. K4B2G0846F-BCK0/MA/NB. 78 Ball -FBGA. Lead Free & Halogen Free, Flip Chip . 1600/1866/2133. 7.5x11mm. Now. 256M x 16. K4B2G1646F -BCK0/MA/NB.

Part Number K4B2G1646F
Brand Samsung Semiconductor
Image Electronic Components
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