Samsung Semiconductor

Description

Feb 15, 2011 AMD makes no representations or warranties with respect to any information provided in this document relating to the products of other companies, and expressly disclaims any implied warranties of merchantability, fitness for a particular purpose, or non-infringement with respect to such products. Sep 2, 2011 JEDEC standard 1.5V 0.075V Power Supply. VDDQ = 1.5V 0.075V. 400MHz fCK for 800Mb/sec/pin, 533MHz fCK for 1066Mb/sec/pin, 667MHz fCK for 1333Mb/sec/pin, 800MHz fCK for 1600Mb/sec/pin,. 933MHz fCK for 1866Mb/ sec/pin. 8 independent internal bank. Programmable CAS Latency: 5 Dec 1, 2012 Now. M391B5273DH0 CF8/H9/K0/MA. 256M x 8 * 18 pcs 2Gb. D-die. Now. M391B5273EB0. CH9 /K0/MA. 256M x 8 * 18 pcs 2Gb. E-die. Now. 1Gx 64. 8GB. M378B1G73BH0. CF8/H9/K0. B(2Rx8). 512M x 8 * 16 pcs 4Gb. B-die. 8. 2. 78 ball. FBGA. 30mm. Now. M378B1G73CB0. CK0. 512M x 8 * 16 pcs 4Gb. NO. Vendor. Module part number. IC Brand. IC Chip Number. SS/DS. Size. 1. KingMax. FLGD45F-B8KG9 NEES . KingMax. KFB8FNGXF-ANX-12A . SS. 1GB . 2. KingMax. FLGE85F-B8KG9 NEES . KingMax. KFB8FNGXF-ANX-12A . DS. 2GB. 3. A-DATA. AX3U1600GB2G9-2G. N/A. N/A. DS. 2GB. 4. G.SKILL. Type. Size. Vendor. Module Name. DDR3 800. 512 MB. Qimonda. IMSH51U03A1F1C-08E. Elpida. PC3-8500U-7-00-AP. Kingston. KVR1066D3N7/ 512. Aeneon. AEH760UD00-10FA98X. Corsair. CM3X1024-1066C7. Elpida. EBJ10UE8BDF0-AE-F. HMT112U6AFP8C-G7N0 AA. HYMT112U64ZNF8-G8 AA . Kingston.