Samsung Semiconductor

Description

M378B5173DB0 . Rev. 1.0, Aug. 2013. SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND. SPECIFICATIONS Dec 1, 2012 M378B5173DB0 . CK0/MA. 512M x 8 * 8 pcs. 4Gb. D-die. 1Q13. 512Mx 72. 4GB. M391B5273CH0. CF8/H9/K0. E(2Rx8). 256M x 8 * 18 pcs 1600/1866. 1. Now. M378B5173DB0 -CK0/MA. 4Gb (512M x8) * 8. Lead Free & Halogen Free. 1600/1866. 1. Now. M378B5173EB0-CK0/MA. 4Gb (512M x8) * 8. Sep 4, 2014 INTEL DISCLAIMS ALL LIABILITY FOR THESE DEVICES, INCLUDING LIABILITY FOR INFRINGEMENT OF ANY PROPRIETARY RIGHTS. Dec 1, 2015 M378B5173QH0. YK0/YMA. A (1Rx8). 512M x 8 * 8 pcs. 4Gb. Q-die. 8. 1. 78ball. FBGA. 30mm. EOL. Q116. 512M x 64. 4GB. M378B5173DB0 .