Description
Now. M391B5773EB0. CH9 /K0/MA. 256M x 8 * 9 pcs. 2Gb. E-die. Now. 512Mx 64. 4GB. M378B5273CH0. CF8/H9/K0. B(2Rx8). 256M x 8 * 16 pcs 2Gb. C-die. 8. Address Configuration. Part Number2. Density. Organization. Component Composition1. Number of. Rank. Height. M378B5173BH0- CH9 /K0/MA. 4GB. 512Mx64.
Part Number | M378B5273CHOCH9 |
Brand | Samsung Semiconductor |
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M378B5273CHOCH9
SAMSUMG
1626
0.86
Aking Limited
M378B5173DB0-CK0
SANSUMG
8156
1.875
Dedicate Electronics (HK) Limited
M378B5273BH1
SAMSUN
45
2.89
SSF Group (Asia) Limited
M378B5273EB0-CK0
SANSUNG
2000
3.905
Top Electronics Co.,
M378B5173EB0-YK0D0
SANGSUNG
20000
4.92
Ande Electronics Co., Limited