Samsung Semiconductor

Description

16GB. M393B2G70EB0. YK0 /CMA. E (2Rx4). 1G x 4 * 36 pcs. 4Gb. E-die. 8. 2. 78ball. FBGA. 30mm. MP. 4G x 72. 32GB. M393B4G70DM0 . YH9. AB (4Rx4). 2G. YF8/H9/K0. 256M x 8 * 16 pcs 2Gb. D-die. Now. M471B5273EB0. YK0 . 256M x 8 * 16 pcs 2Gb. E-die. Now. M471B5173CB0. YH9/K0. B(1Rx8). 512M x 8 * 8 pcs. Now. M393B2G70EB0- YK0 (02/03). 4Gb (1G x4) * 36. Lead Free & Halogen Free , Flip Chip. 1600. 2. Now. 32GB. 1.35V. 4G x 72. M393B4G70DM0 -YH9(02/03). Jan 16, 2015 Inphi. UV-GS02. Samsung M393B1G73QH0- YK0 Samsung M393B1G70QH0- YK0 . 8GB. 11. C . Samsung M393B4G70DM0 -YH9. 32GB. 9. Sep 6, 2011 Page 1. - 1 -. M393B5773DH0. M393B5273DH0. Rev. 1.2, Aug. 2011. SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE