Samsung Semiconductor

Description

Nov 7, 2011 Samsung M393B5673GB0 - CH9 . 2GB. 9. B. Samsung K4B1G0846G-BCH9. 1Gb x8. 1104 IDT. A1. Samsung M393B5273BH1-CH9. 4GB. 9. B. CH9 /K0/MA. A(1Rx8). 128M x 8 * 9 pcs. 1Gb. G-die. 8. 1. 78 ball. FBGA. 30mm. Now. 256Mx 72. 2GB. M393B5673GB0 . CH9 /K0/MA. B(2Rx8). 128M x 8 * 18 pcs. FBGA. 30mm. Now. M393B5673GB0 . CF8/H9/K0/MA. 128M x 8 * 18 pcs. 1Gb. G- die. Now. M393B5670FH0. CF8/H9/K0. C(1Rx4). 256M x 4 * 18 pcs. 1Gb. F-die. M391B5273EB0. CH9 . 256M x 8 * 18 pcs 2Gb. E-die. Nov11. 1Gx 64. 8GB. M378B1G73AH0. CF8/H9/K0. B(2Rx8) . M393B5673GB0 . CF8/H9/K0/MA. B( 2Rx8). 1. Now. 2GB. 1.5V. 256Mx72. M393B5673GB0 -C(F8/H9/K0/MA)(08/09) 1Gb ( 128M x8) * 18. Lead Free & Halogen Free, Flip Chip 1066/1333/1600/1866. 2. Now.