Samsung Semiconductor

Ref. [hkinsamsungsemiconductor20220620][hkinbrandcloudAMpd]

We spark the imagination of device manufacturers with top-of-the-line building blocks of the digital area, powering billions of devices, and through them, touching the lives of people around the world every day. Samsung promises cutting-edge components services, TCO solutions and technical services with the widest product portfolio in the industry and adds value through our flexibility to collaborate with customers and partners, leveraging resources throughout the product development process.

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Description

Oct 1, 2012 High density NAND flash memories. Up to 256-Mbit memory array. Up to 32- Mbit spare area. Cost effective solutions for mass storage. 2011 6 8 NAND256W3A2BN6E . Table of Toxic and Hazardous Substances/Elements and their Content as required by Chinas Management Methods for Features. Organization: Page size: x8: 2,112 bytes (2,048 + 64 bytes) x16: 1,056 words (1,024 + 32 words). Block size: 64 pages (128K + 4K bytes). Device NAND256W3A2BN6E . 96. 576. . . NAND256W3A2BN6F. . . 1500. 32 x 16. NAND256W3A2BNXE. 96. 576. . . Table 5: NAND Flash Memory (continued).

Part Number NAND256W3A2BN6E
Main Category Integrated Circuits (ICs)
Sub Category Memory
Brand Samsung Semiconductor
Description IC FLASH 256MBIT 50NS 48TSOP
Series -
Packaging Tray
Memory Type Non-Volatile
Memory Format FLASH
Technology FLASH - NAND
Memory Size 256Mb (32M x 8)
Clock Frequency -
Write Cycle Time - Word, Page 50ns
Access Time 50ns
Memory Interface Parallel
Voltage - Supply 2.7 V ~ 3.6 V
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 48-TFSOP (0.724", 18.40mm Width)
Supplier Device Package 48-TSOP
Image Integrated Circuits (ICs)
Lowest Price: $0.43   Highest Price: $5.58
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RX ELECTRONICS LIMITED

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HK HEQING ELECTRONICS LIMITED

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2019
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CIS Ltd (CHECK IC SOLUTION LIMITED)

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