Description
Oct 1, 2012 High density NAND flash memories. Up to 256-Mbit memory array. Up to 32- Mbit spare area. Cost effective solutions for mass storage. 2011 6 8 NAND256W3A2BN6E . Table of Toxic and Hazardous Substances/Elements and their Content as required by Chinas Management Methods for Features. Organization: Page size: x8: 2,112 bytes (2,048 + 64 bytes) x16: 1,056 words (1,024 + 32 words). Block size: 64 pages (128K + 4K bytes). Device NAND256W3A2BN6E . 96. 576. . . NAND256W3A2BN6F. . . 1500. 32 x 16. NAND256W3A2BNXE. 96. 576. . . Table 5: NAND Flash Memory (continued).
Part Number | NAND256W3A2BN6E |
Main Category | Integrated Circuits (ICs) |
Sub Category | Memory |
Brand | Samsung Semiconductor |
Description | IC FLASH 256MBIT 50NS 48TSOP |
Series | - |
Packaging | Tray |
Memory Type | Non-Volatile |
Memory Format | FLASH |
Technology | FLASH - NAND |
Memory Size | 256Mb (32M x 8) |
Clock Frequency | - |
Write Cycle Time - Word, Page | 50ns |
Access Time | 50ns |
Memory Interface | Parallel |
Voltage - Supply | 2.7 V ~ 3.6 V |
Operating Temperature | -40°C ~ 85°C (TA) |
Mounting Type | Surface Mount |
Package / Case | 48-TFSOP (0.724", 18.40mm Width) |
Supplier Device Package | 48-TSOP |
Image |
Hot Offer
NAND256W3A2BN6E
SAMSUN
99000
3.005
INKSON LIMITED
NAND256W3A2BN6E
SANSUNG
4563
4.2925
SUNTOP SEMICONDUCTOR CO., LIMITED
NAND256W3A2BN6E
SANGSUNG
806
5.58
RX ELECTRONICS LIMITED
NAND256W3A2BN6E
SAMSUMG
4577
0.43
HK HEQING ELECTRONICS LIMITED
NAND256W3A2BN6E
SANSUMG
2900
1.7175
CIS Ltd (CHECK IC SOLUTION LIMITED)